Optical sensor assembly

ABSTRACT

An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. patentapplication Ser. No. 16/458,626 filed on Jul. 1, 2019, which claims thepriority benefit of U.S. Provisional Application Ser. No. U.S.62/714,132, filed on Aug. 3, 2018, the full disclosures of which areincorporated herein by reference.

BACKGROUND 1. Field of the Disclosure

This disclosure generally relates to an optical sensor and, moreparticularly, to an optical sensor assembly.

2. Description of the Related Art

Optical sensors, such as sensors for detecting infra-red light orvisible light, are ubiquitous in various electronic devices such asmobile phones and tablet computers. Optical sensors are fragileelectronic components that should be protected from water, dust, damageand interference from ambient environment.

SUMMARY

The present disclosure is related to an optical sensor assembly thatincludes a front cover for accommodating and protecting an opticalsensor from various hazards of the ambient environment, and the frontcover has an optical element for condensing incident light.

The present disclosure is related to another optical sensor assemblythat includes a front cover for accommodating and protecting an opticalsensor from various hazards of the ambient environment, and the frontcover has an optical element having a tilt angle with respect to aplanar frame of the front cover.

The present disclosure is related to another optical sensor assemblythat includes a front cover for accommodating and protecting an opticalsensor from various hazards of the ambient environment, and the frontcover has an optical element parallel to a sensing surface of theoptical sensor and configured to guide incident light to the opticalsensor.

The present disclosure provides an optical sensor assembly including acircuit board, an optical sensor and a front cover. The optical sensoris positioned on a front surface of the circuit board. The front coveris attached to the front surface of the circuit board, covers theoptical sensor and has two wings protruding in opposite directions. Thefront cover includes an optical element located between the two wingsand is configured to condense an incident light of a predeterminedwavelength onto the optical sensor. The front cover is made ofpolypropylene or polyethylene. The predetermined wavelength is in arange from 8 micrometers to 12 micrometers.

The present disclosure further provides an optical sensor assemblyincluding a circuit board, an optical sensor and a front cover. Theoptical sensor is attached to a front surface of the circuit board. Thefront cover is attached to the front surface of the circuit board andhas two wings protruding in opposite directions from a central cylinderof the front cover. The front cover includes an optical element sealingone opening of the central cylinder, and another opening of the centralcylinder forms a receiving cavity for accommodating the optical sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, advantages, and novel features of the present disclosurewill become more apparent from the following detailed description whentaken in conjunction with the accompanying drawings.

FIGS. 1, 2, 3 and 4 are schematic diagrams of an optical sensor assemblyaccording to one embodiment of the present disclosure.

FIGS. 5, 6 and 7 are schematic diagrams of an optical sensor assemblyaccording to another embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENT

It should be noted that, wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.The separate embodiments in the present disclosure below may be combinedtogether to achieve superimposed functions.

FIGS. 1, 2, 3 and 4 are schematic diagrams of an optical sensor assembly100 according to one embodiment of the present disclosure. The opticalsensor assembly 100 includes a circuit board 110 (e.g., a printedcircuit board or a flexible circuit board), an optical sensor 120, aconnector 130, and a front cover 140. FIG. 1 is a side view of thecircuit board 110, the optical sensor 120, and the connector 130. FIG. 2is a rear view of the front cover 140. FIG. 3 is a front view of thefront cover 140 attached to the circuit board 110. FIG. 4 is anotherview of the circuit board 110 on which the front cover 140 is not yetattached. The connector 130 is attached to a back surface 152 of thecircuit board 110, and the front cover 140 is attached to a frontsurface 151 of the circuit board 110.

The optical sensor 120 is positioned on and electrically connected tothe circuit board 110. The connector 130 is positioned on the circuitboard 110. The connector 130 is used to transmit electrical signals toand from the optical sensor 120. In addition, the connector 130 is usedto transmit electrical signals between the optical sensor 120 and anexternal electronic device that adopts the optical sensor assembly 100.The front cover 140 is attached to the circuit board 110 and covers theoptical sensor 120. The front cover 140 includes an optical element 145used to allow incident light of a predetermined wavelength to transmitthrough the optical element 145 and condense the incident light onto theoptical sensor 120. The optical element 145 is a convex lens or aFresnel lens.

In one embodiment, an outer surface 153 of the optical element 145 is aplane surface, and the convex lens or the Fresnel lens is formed at aninner surface 154 of the optical element 145.

However, the present disclosure is not limited thereto. In onenon-limiting aspect, the optical element 145 is a transparent layer usedto guide incident light to the optical sensor 120 without condensing ordiverging the incident light.

It should be mentioned that although FIG. 3 shows that the outer surface153 of the optical element 145 is substantially parallel to the frontsurface 151 of the circuit board 110, the present disclosure is notlimited thereto. According to an incident direction of the incidentlight, the outer surface 153 of the optical element 145 is preferablytilted to be perpendicular to the incident direction.

In one embodiment, the front cover 140, including the optical element145, is made of polypropylene or polyethylene. The whole front cover140, including the optical element 145, is produced via injectionmolding as a single piece. However, the present disclosure is notlimited thereto. In one non-limiting aspect, the optical element 145 isformed separately from the front cover 140, and then squeezed into thefront cover 140.

In another embodiment, the optical element 145 includes at least one ofa polypropylene film, a polyethylene film, a silicon film, a germaniumfilm, and a diamond-like carbon film.

In one embodiment, the optical sensor 120 is a far infra-red thermalsensor used to detect a temperature of a thermal source. Theaforementioned predetermined wavelength of the incident light is in arange from 8 micrometers to 12 micrometers, and the optical element 145is used to allow the incident light to transmit through the opticalelement 145 with a transmittance in a range from 20% to 80%.

In another embodiment, the optical sensor 120 is an ambient lightsensor. The aforementioned predetermined wavelength of the incidentlight is in a range from 390 nanometers to 700 nanometers.

The optical sensor 120 generates electrical signals by detecting theincident light penetrating the optical element 145. The connector 130transmits the electrical signals to a processor of an electronic devicefor predetermined control.

In one non-limiting aspect, the front cover 140 further includes atleast one alignment peg 141 (e.g., two alignment pegs 141 being shown inFIG. 2), and the circuit board 110 includes at least one alignment hole142 (e.g., two alignment hole 142 being shown in FIG. 3) used to receivethe at least one alignment peg 141, and the at least one alignment peg141 is formed integrally with the front cover 140. The front cover 140further includes at least one screw hole 143 used to receive at leastone screw for attaching and fixing the front cover 140 to the circuitboard 110.

In the embodiment shown in FIGS. 2, 3 and 4, the front cover 140includes two alignment pegs 141 and two screw holes 143, and the circuitboard 110 includes two alignment holes 142. In another embodiment, thefront cover 140 includes more or less alignment pegs 141 and more orless screw holes 143, and the circuit board 110 includes more or lessalignment holes 142.

The front cover 140 further includes a receiving cavity 147 used toaccommodate the optical sensor 120 attached on the circuit board 110.The front cover 140 is attached to the circuit board 110 via awater-proof and dust-proof adhesive, so that the circuit board 110, theadhesive, and the front cover 140 around the receiving cavity 147 form asealed enclosure for accommodating and protecting the optical sensor 120from various hazards of the ambient environment, such as water, dust,electrical damage and mechanical damage. In the aspect that the frontcover 140 is combined with the circuit board 110 via adhesive, the atleast one screw hole 143 is not implemented.

It should be mentioned that although the front cover 140 is shown tohave curved edges between two protruding ends, it is only to illustratebut not to limit the present disclosure. In other embodiments, the frontcover 140 has other shapes such as a rectangular shape according to areceiving opening of the electronic device adopting the optical sensorassembly 100.

FIGS. 5, 6 and 7 are schematic diagrams of an optical sensor assembly200 according to another embodiment of the present disclosure. Theoptical sensor assembly 200 includes a circuit board 210 (e.g., aprinted circuit board or a flexible circuit board), an optical sensor220, a connector 240, a front cover 230, and a back cover 250. FIG. 5 isa side view of the circuit board 210, the optical sensor 220, theconnector 240, the front cover 230, and the back cover 250. FIG. 6 is arear view of the circuit board 210, the connector 240, the front cover230, and the back cover 250. FIG. 7 is a front view of the front cover230.

In one non-limiting embodiment, when the circuit board 210 is fixed orsealed well with the front cover 230 to prevent dust and water fromcontacting the optical sensor 220, the back cover 250 is notimplemented.

The optical sensor 220 is attached to a front surface 281 of the circuitboard 210, and the optical sensor 220 is electrically connected with thecircuit board 210. The front cover 230 includes a receiving cavity 260used to receive at least the optical sensor 220. In one non-limitingembodiment, the receiving cavity 260 receives both the circuit board 210and the optical sensor 220. The front cover 230 further includes anoptical element 231 used to allow incident light of a predeterminedwavelength to transmit through the optical element 231 and condense theincident light onto the optical sensor 220. The optical element 231 is aconvex lens or a Fresnel lens.

In one embodiment, an outer surface 283 of the optical element 231 is aplane surface, and the convex lens or the Fresnel lens is formed at aninner surface 284 of the optical element 231.

However, the present disclosure is not limited thereto. In onenon-limiting aspect, the optical element 231 is a transparent layer usedto guide incident light to the optical sensor 220 without condensing ordiverging the incident light.

In one embodiment, the optical sensor 220 is a far infra-red thermalsensor used to detect a temperature of a thermal source. Theaforementioned predetermined wavelength of the incident light is in arange from 8 micrometers to 12 micrometers, and the optical element 231is used to allow the incident light to transmit through the opticalelement 231 with a transmittance in a range from 20% to 80%.

In another embodiment, the optical sensor 220 is an ambient lightsensor. The aforementioned predetermined wavelength of the incidentlight is in a range from 390 nanometers to 700 nanometers.

The front cover 230 further includes a curved sheet 233, a planar frame234 connected to and surrounding the curved sheet 233, and a wallstructure 270 positioned on the curved sheet 233. In another embodiment,the wall structure 270 is connected to the planar frame 234. Thereceiving cavity 260 is positioned in and formed by the wall structure270. The optical element 231 is a part of the curved sheet 233. In oneembodiment, the curved sheet 233 has a plane surface within a region ofthe optical element 231, and the rest part of the curved sheet 233 has acurved surface.

The optical sensor 220 is aligned with the optical element 231.Preferably, the optical element 231 is parallel to a sensing surface 285of the optical sensor 220. In one aspect, the whole curved sheet 233 istransparent to the incident light. In another aspect, the curved sheet233 is transparent to the incident light only within a region of theoptical element 231, and the rest part of the curved sheet 233 is opaqueor semi-opaque to the incident light.

In one embodiment, the optical element 231 and the optical sensor 220are neither parallel nor perpendicular to the planar frame 234, as shownin FIG. 5. The angle difference between the planar frame 234 and theoptical element 231 is determined based on design requirements of theoptical sensor assembly 200.

In another embodiment, the optical element 231 and the optical sensor220 are parallel to the planar frame 234. The optical element 231 is apart of the curved sheet 233. The circuit board 210 is attached to thewall structure 270. The shapes of the curved sheet 233 and the wallstructure 270 are arranged such that the optical element 231, theoptical sensor 220, and the circuit board 210 (determined by a tileangle of the outer loop wall 272) are all parallel. When the tile angleis changed, a light receiving angle of the optical element 231 andoptical sensor 220 is also altered.

The wall structure 270 includes an inner loop wall 271 surrounding theoptical element 231 and an outer loop wall 272 surrounding the innerloop wall 271. The inner loop wall 271 and the outer loop wall 272 havedifferent heights at different edges of the front cover 230, e.g., lowerat an upper edge and higher at a lower edge to cause the optical sensor220 to have an angle difference with respect to the planar frame 234.

One end of the inner loop wall 271 is connected to the curved sheet 233and another end of the inner loop wall 271 has an opening 276. One endof the outer loop wall 272 is connected to the curved sheet 233 andanother end of the outer loop wall 272 has an opening 277. The area ofthe circuit board 210 is between the area of the opening 276 of theinner loop wall 271 and the area of the opening 277 of the outer loopwall 272. In other words, the area of the circuit board 210 is largerthan the area of the opening 276 of the inner loop wall 271, and thearea of the circuit board 210 is smaller than the area of the opening277 of the outer loop wall 272 so as to be accommodated in the outerloop wall 272.

The receiving cavity 260 includes a first cavity 261 for receiving theoptical sensor 220 and a second cavity 262 for receiving the circuitboard 210. The first cavity 261 is positioned in the inner loop wall271. The second cavity 262 is positioned in the outer loop wall 272.

To enhance the mechanical strength, the wall structure 270 furtherincludes a plurality of ridge walls 273 connecting the inner loop wall271, the outer loop wall 272 and the curved sheet 233. Each of the ridgewalls 273 has an indent 274 on an edge 275 of that ridge wall 273connecting the inner loop wall 271 and the outer loop wall 272. Thesecond cavity 262 is formed by the indents 274 of all of the ridge walls273.

In one non-limiting embodiment, the indents 274 and the second cavity262 are not implemented. In this case, the circuit board 210 is attachedto the inner loop wall 271 and the ridge walls 273 to seal the firstcavity 261.

In one non-limiting embodiment, the ridge walls 273 are not implemented.In this case, the opening 277 of the outer loop wall 272 defines thesecond cavity 262.

In one non-limiting embodiment, the inner loop wall 271 is notimplemented. In another one non-limiting embodiment, the outer loop wall272 is not implemented. In another one non-limiting embodiment, both ofthe inner loop wall 271 and the outer loop wall 272 are not implemented.

According to FIG. 6, there are spaces between the ridge walls 273, theinner loop wall 271 and the outer loop wall 272. However, the presentdisclosure is not limited thereto. In one non-limiting embodiment, theridge walls 273 fill all the spaces between the inner loop wall 271 andthe outer loop wall 272 so that the wall structure 270 is a thick andsolid loop wall surrounding the optical element 231 and the first cavity261.

In one embodiment, the front cover 230, including the optical element231, is made of polypropylene or polyethylene. The front cover 230,including the optical element 231 and the wall structure 270, isproduced via injection molding as a single piece. However, the presentdisclosure is not limited thereto. In one non-limiting aspect, theoptical element 231 is formed separately and has different materialsfrom the front cover 230, and then combined with the front cover 230.

In another embodiment, the optical element 231 includes at least one ofa polypropylene film, a polyethylene film, a silicon film, a germaniumfilm, and a diamond-like carbon film.

The connector 240 is attached to a back surface 282 of the circuit board210, and the connector 240 is electrically connected to the circuitboard 210. The connector 240 is used to transmit electrical signals toand from the optical sensor 220. In addition, the connector 240 is usedto transmit electrical signals between the optical sensor 220 and anexternal electronic device that adopts the optical sensor assembly 200.The back cover 250 is attached to the outer loop wall 272, for example,via a water-proof and dust-proof adhesive. The back cover 250 is used toseal the opening 277 of the outer loop wall 272. The back cover 250 hasan opening 255 used to expose an end 245 of the connector 240.

The optical sensor 220 generates electrical signals by detecting theincident light penetrating the optical element 231. The connector 240transmits the electrical signals to a processor of an electronic devicefor predetermined control.

In one embodiment, the circuit board 210 is attached to the inner loopwall 271 and the ridge walls 273, for example, via a water-proof anddust-proof adhesive. In this way, the circuit board 210, the inner loopwall 271, the curved sheet 233, and the optical element 231 form asealed enclosure for accommodating and protecting the optical sensor 220from various hazards of the ambient environment, such as water, dust,electrical damage and mechanical damage. The outer loop wall 272 and theback cover 250 provide additional protection for the optical sensor 220against the hazards of the ambient environment.

In one embodiment, the optical sensor assembly 200 is applied to anelectronic device. The front cover 230 further includes at least onelatching hook 232 configured for attaching the optical sensor assembly200 to the other parts of the electronic device. In the embodiment shownin FIGS. 5, 6 and 7, the front cover 230 includes two latching hooks232. In another embodiment, the front cover 230 includes more or lesslatching hooks 232.

In one non-limiting embodiment, the optical sensor assembly 200 isattached to the electronic device by other means such as screws oradhesive, and the at least one latching hook 232 is not implemented.

It should be mentioned that although the front cover 230 is shown tohave a rectangular appearance, it is only to illustrate but not to limitthe present disclosure. In other embodiments, the front cover 230 hasother shapes such as a circular or ellipse shape according to areceiving opening of the electronic device adopting the optical sensorassembly 200.

In the present disclosure, the type of the connector 130 and 240 is notparticularly limited as long as it is combinable to another connector ofan electronic device that adopts the optical sensor assembly a00 and200.

Although the disclosure has been explained in relation to its preferredembodiment, it is not used to limit the disclosure. It is to beunderstood that many other possible modifications and variations can bemade by those skilled in the art without departing from the spirit andscope of the disclosure as hereinafter claimed.

What is claimed is:
 1. An optical sensor assembly, comprising: a circuitboard; an optical sensor positioned on a front surface of the circuitboard; and a front cover attached to the front surface of the circuitboard, covering the optical sensor and having two wings protruding inopposite directions, wherein the front cover comprises an opticalelement located between the two wings and configured to condense anincident light of a predetermined wavelength onto the optical sensor,the front cover is made of polypropylene or polyethylene, and thepredetermined wavelength is in a range from 8 micrometers to 12micrometers.
 2. The optical sensor assembly of claim 1, wherein theoptical element has a transmittance in a range from 20% to 80%.
 3. Theoptical sensor assembly of claim 1, wherein the front cover is producedvia injection molding as a single piece.
 4. The optical sensor assemblyof claim 1, wherein the optical element comprises at least one of apolypropylene film, a polyethylene film, a silicon film, a germaniumfilm, and a diamond-like carbon film.
 5. The optical sensor assembly ofclaim 1, wherein the optical element comprises a convex lens or aFresnel lens, and the convex lens or the Fresnel lens is located at aninner surface of the optical element.
 6. The optical sensor assembly ofclaim 5, wherein an outer surface of the optical element is a convexsurface or a plane surface.
 7. The optical sensor assembly of claim 1,wherein the front cover further comprises: at least one alignment peglocated between the optical element and the two wings, and at least onescrew hole located at the two wings and configured to receive at leastone screw for attaching the front cover to the circuit board, and thecircuit board comprises at least one alignment hole configured toreceive the at least one alignment peg.
 8. The optical sensor assemblyof claim 1, wherein the front cover further comprises a receiving cavityconfigured to accommodate the optical sensor, and the front cover isattached to the circuit board via adhesive.
 9. The optical sensorassembly of claim 1, further comprising a connector positioned on a backsurface of the circuit board and configured to transmit electricalsignals to and from the optical sensor.
 10. The optical sensor assemblyof claim 1, wherein the optical sensor is a far infra-red thermal sensoror an ambient light sensor.
 11. An optical sensor assembly, comprising:a circuit board; an optical sensor attached to a front surface of thecircuit board; and a front cover attached to the front surface of thecircuit board and having two wings protruding in opposite directionsfrom a central cylinder of the front cover, wherein the front covercomprises an optical element sealing one opening of the centralcylinder, and another opening of the central cylinder forms a receivingcavity for accommodating the optical sensor.
 12. The optical sensorassembly of claim 11, wherein the front cover is configured to condensean incident light of wavelengths within 8 micrometers and 12micrometers.
 13. The optical sensor assembly of claim 11, wherein thefront cover is made of polypropylene or polyethylene, and has atransmittance in a range from 20% to 80%.
 14. The optical sensorassembly of claim 11, wherein the optical element comprises at least oneof a polypropylene film, a polyethylene film, a silicon film, agermanium film, and a diamond-like carbon film.
 15. The optical sensorassembly of claim 11, wherein the optical element comprises a convexlens or a Fresnel lens located at an inner surface of the opticalelement.
 16. The optical sensor assembly of claim 15, wherein an outersurface of the optical element is a convex surface or a plane surface.17. The optical sensor assembly of claim 1, wherein the front coverfurther comprises: two alignment pegs respectively located between theoptical element and the two wings, and two screw holes respectivelylocated at the two wings and configured to receive two screws for fixingthe front cover to the circuit board, and the circuit board comprisestwo alignment holes configured to receive the two alignment pegs. 18.The optical sensor assembly of claim 11, further comprising a connectorpositioned on a back surface of the circuit board and configured totransmit electrical signals to and from the optical sensor.
 19. Theoptical sensor assembly of claim 11, wherein the optical sensor is a farinfra-red thermal sensor or an ambient light sensor.
 20. The opticalsensor assembly of claim 11, wherein the front cover is produced viainjection molding as a single piece.